Integrated feature scale modeling of plasma processing of porous and solid SiO2. II. Residual fluorocarbon polymer stripping and barrier layer deposition-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Integrated feature scale modeling of plasma processing of porous and solid SiO2. II. Residual fluorocarbon polymer stripping and barrier layer deposition

Published:2004-07 Issue:4 Volume:22 Page:1260-1274
ISSN:0734-2101
Container-title:Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films
language:en
Short-container-title:Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films

Author:

Sankaran Arvind,Kushner Mark J.

Publisher

American Vacuum Society

Subject

Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics

Link

http://avs.scitation.org/doi/pdf/10.1116/1.1764822

Cited by 20 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Review and perspective of dry etching and deposition process modeling of Si and Si dielectric films for advanced CMOS device applications;Japanese Journal of Applied Physics;2024-08-01

2. Review and future perspective of feature scale profile modeling for high-performance semiconductor devices;Journal of Micro/Nanopatterning, Materials, and Metrology;2023-11-22

3. The 2021 release of the Quantemol database (QDB) of plasma chemistries and reactions;Plasma Sources Science and Technology;2022-09-01

4. Gap length effect on discharge mode and etching profiles in asymmetric dual frequency capacitive CF₄/Ar discharges;Acta Physica Sinica;2021

5. Plasma etching of high aspect ratio features in SiO2 using Ar/C4F8/O2 mixtures: A computational investigation;Journal of Vacuum Science & Technology A;2019-05

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP