Effect of water vapor on plasma processing at atmospheric pressure: Polymer etching and surface modification by an Ar/H2O plasma jet-Reference-Cited by-同舟云学术

Effect of water vapor on plasma processing at atmospheric pressure: Polymer etching and surface modification by an Ar/H2O plasma jet

Published:2019-05 Issue:3 Volume:37 Page:031305
ISSN:0734-2101
Container-title:Journal of Vacuum Science & Technology A
language:en
Short-container-title:Journal of Vacuum Science & Technology A

Author:

Luan Pingshan¹^ORCID,Kondeti V. S. Santosh K.²,Knoll Andrew J.¹,Bruggeman Peter J.²,Oehrlein Gottlieb S.¹^ORCID

Affiliation:

1. Department of Materials Science and Engineering and the Institute for Research in Electronics and Applied Physics, University of Maryland, College Park, Maryland 20742

2. Department of Mechanical Engineering, University of Minnesota, Minneapolis, Minnesota 55455

Funder

National Science Foundation

U.S. Department of Energy

Publisher

American Vacuum Society

Subject

Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics

Link

http://avs.scitation.org/doi/am-pdf/10.1116/1.5092272

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