Plasma etching of thick polynorbornene layers for electronic packaging applications
Author:
Publisher
American Vacuum Society
Subject
General Engineering
Cited by 5 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. A Parylene temporary packaging technique for MEMS wafer handling;Sensors and Actuators A: Physical;2012-10
2. Metal–Polymer Composite Interconnections for Ultra Fine-Pitch Wafer Level Packaging;IEEE Transactions on Advanced Packaging;2007-08
3. MEMS composite structures for tunable capacitors and IC-package nano interconnects;2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546)
4. High aspect ratio metal-polymer composite structures for nano interconnects;2004 1st IEEE Consumer Communications and Networking Conference (IEEE Cat. No.04EX745)
5. Ultra fine-pitch wafer level packaging with reworkable composite nano-interconnects;Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971)
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