Mechanical aspects of multichip module reliability

Author:

Knorr David B.

Publisher

Springer Science and Business Media LLC

Subject

General Engineering,General Materials Science

Reference86 articles.

1. “Very Large Computers Enter the Age of Multichip Assembly on a Low Permittivity Substrate,” Nikkei Microdevices (November 1990).

2. F. Kobayashi et al., “Hardware Technology for Hitachi M880 Processor Group,” Proceedings of 41st Electronic Components and Technology Conference (New York: IEEE, 1991), pp. 693–703.

3. T. Inoue et al., “Micro Carrier for LSI Chip Used in the Hitachi M-880 Processor Group,” in Ref. 2, pp. 704–711.

4. R.R. Tummala, “Ceramic and Glass-Ceramic Packaging in the 1990s,” J. Amer. Ceramic Soc., 74(5) (1991), pp. 895–908.

5. Nikkei Microdevices (12 December 1989).

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