Author:
Cho Jun Dong,Sarrafzadeh Majid
Publisher
Springer Science and Business Media LLC
Subject
General Mathematics,Software
Reference41 articles.
1. H.B. Bakoglu,Circuits, Interconnections, and Packaging for VLSI (Addison-Wesley, Reading, MA, 1990) pp. 81–112.
2. J.L. Bentley and T. Ottmann, “Algorithm for reporting and counting Geometric Intersections,”IEEE Transactions on Computer C-28 (1979) 643–647.
3. A.J. Blodgett, “Microelectronic Packaging,”Scientific American (1983) 86–96.
4. A.J. Blodgett and D.R. Barbour, “Thermal conduction module: A high performance multilayer ceramic package,”IBM Journal of Research and Development 26(1) (1982) 30–36.
5. M.L. Brady and D.J. Brown, “VLSI routing: Four layers suffice,” in: F.P. Preparata, ed.,VLSI Theory No. 2. Advances in Computing Research (JAI Press, Greenwich, CT, 1984) pp. 245–257.
Cited by
2 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Discrete Network Location Models;Facility Location;2002
2. Four-bend top-down global routing;IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems;1998