Author:
Denton D. D.,Day D. R.,Priore D. F.,Senturia S. D.,Anolick E. S.,Scheider D.
Publisher
Springer Science and Business Media LLC
Subject
Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Reference12 articles.
1. R. A. Larsen, IBM J. Res. Develop.24, 268 (1980).
2. K. Mukai, A. Saiki, K. Yamanaka, S. Harada, and S. Shoji, IEEE J. Solid St. Ckts.SC-13, 462 (1978).
3. K. Sato, S. Harada, T. Kimura, T. Okubo and K. Mukai, IEEE Trans, on Parts, Hybrids and Pkging.PHP-9, 176 (1973).
4. P. Shah, D. Laks, and A. Wilson, “High Performance, High Density MOS Process Using Polyimide Interlevel Insulation”, IEEE Proc. IEDM, paper 20.4, 465–468, December 1979.
5. A. M. Wilson, Thin Solid Films,83, 145 (1981).
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