Effect of Johnson–Cook Material Model Constants on Predicted Chip Morphology and Forces in FE Simulations of Machining Operation for 93% WHA Alloy
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Publisher
Springer Singapore
Link
http://link.springer.com/content/pdf/10.1007/978-981-32-9487-5_18
Reference19 articles.
1. Baker, M.: The influence of plastic properties on chip formation. Comput. Mater. Sci. 28(3–4), 556–562 (2003)
2. Wang, J., Zhao, G., Chen, L., Li, J.: A comparative study of several constitutive models for powder metallurgy tungsten at elevated temperature. Mater. Design 90, 91–100 (2016)
3. He, A., Xie, G., Zhang, H., Wang, X.: A comparative study on Johnson-Cook, modified Johnson-Cook and Arrhenius-type constitutive models to predict the high temperature flow stress in 20CrMo alloy steel. Mater. Des. 52, 677–685 (2013)
4. Jivishov, V., Rzayev, E.: Influence of material models used in finite element modeling on cutting forces in machining. In: VII International Scientific Practical Conference “Innovative Technologies in Engineering”. IOP Publishing 142(1) (2016)
5. Zhang, Y.C., Mabrouki, T., Nelias, D., Gong, Y.D.: Chip formation in orthogonal cutting considering interface limiting shear stress and damage evolution based on fracture energy approach. Finite Elem. Anal. Des. 47(7), 850–863 (2011)
Cited by 2 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Review on the effect of surface textured tool in the field of machining;Advances in Materials and Processing Technologies;2023-03-02
2. An Alternate Approach to SHPB Tests to Compute Johnson-Cook Material Model Constants for 97 WHA at High Strain Rates and Elevated Temperatures Using Machining Tests;Journal of Manufacturing Science and Engineering;2020-10-07
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