Author:
Kumar Manoj,Bisht Vikram,Chandel Sheshang Singh,Sinha-Ray Sumit,Kumar Pradeep
Reference26 articles.
1. Y. Shabany, Heat Transfer: Thermal Management of Electronics (CRC press, 2009)
2. D.B. Tuckerman, R.F.W. Pease, High-performance heat sinking for VLSI. IEEE Electron. Device Lett. 2(5), 126–129 (1981)
3. M. Groll, M. Schneider, V. Sartre, M.C. Zaghdoudi, M. Lallemand, Thermal control of electronic equipment by heat pipes.Revue générale de thermique 37(5): 323–352 (1998)
4. C.B. Sobhan, R.L. Rag, G.P. Peterson, A review and comparative study of the investigations on micro heat pipes. Int. J. Energy Res. 31(6–7), 664–688 (2007)
5. S.U.S. Choi, A.E. Jeffrey, Enhancing Thermal Conductivity of Fluids with Nanoparticles. No. ANL/MSD/CP-84938; CONF-951135-29. Argonne National Lab., IL (United States), 1995.
Cited by
5 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献