Publisher
Springer Nature Singapore
Reference30 articles.
1. Viswanath R, Wakharkar V, Watwe A, Lebonheur V (2000) Thermal performance challenges from silicon to systems. Intel Tech J Q3
2. Karus AD, Bar-Cohen A (1983) Thermal analysis and control of electronic equipment, vol 1. Hemisphere Publishing Corporation, Washington DC, p 633
3. Grimes R, Wlash E, Walsh P (2010) Active cooling of a mobile phone handset. Appl Therm Eng 30(16):2363–2369
4. Lu X, Hua T, Liu M, Cheng Y (2009) Thermal analysis of loop heat pipe used for high power LED. Thermochem Acta 493:25–29
5. Saxena V, Kothari R, Sahu SK, Kundalwal SI (2021) An analytical approach for predicting the effective thermal conductivity of coated metal foams infiltrated with phase change materials. In: Proceedings of the 26th national and 4th international ISHMT-ASTFE heat and mass transfer conference. IIT Madras, Chennai, pp 2039–2044. https://doi.org/10.1615/IHMTC-2021.3080