Study on Electrochemical Deposition of Thick Copper Pillars for Wafer Level Integration
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Publisher
Springer Nature Singapore
Link
https://link.springer.com/content/pdf/10.1007/978-981-97-3958-5_10
Reference10 articles.
1. Lu J-Q (2009) 3-D hyper integration and packaging technologies for micro-nano systems. Proc IEEE 97(1)
2. Esashi M (2009) Wafer level packaging of MEMS. In: International solid-state sensors, actuators and microsystems conference, Denver, CO, USA, pp 9–16. https://doi.org/10.1109/SENSOR.2009.5285574
3. Shimokawa K, Hashino E, Ohzeki Y, Tatsumi K (1998) Micro-ball bump for flip chip interconnections. In: Proceedings 48th electronic components and technology conference (Cat. No. 98CH36206), Seattle, WA, USA, 1998, pp 1472–1476. https://doi.org/10.1109/ECTC.1998.678939
4. Dixit P, Tan CW, Xu L, Lin N, Miao J, Pang JHL, Backus P, Preisser R (2007) Fabrication and characterization of fine pitch on-chip copper interconnects for advanced wafer level packaging by a high aspect ratio through AZ9260 resist electroplating. J Micromech Microeng 17:1078. https://doi.org/10.1088/0960-1317/17/5/030
5. Koukharenko E, Kraft M, Ensell GJ, Hollinshead N (2005) A comparative study of different thick photoresists for MEMS applications. J Mater Sci: Mater Electron 16:741–747. https://doi.org/10.1007/s10854-005-4977-2
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