Thermal Management of Electronics Systems—Current Trends and Future Applications
Author:
Publisher
Springer Nature Singapore
Link
https://link.springer.com/content/pdf/10.1007/978-981-19-4502-1_20
Reference21 articles.
1. Aragones X, Barajas E, Crespo-Yepes A, Mateo D, Rodriguez R, Martin-Martinez J, Nafria M (2021) Aging in CMOS RF linear power amplifiers: an experimental study. IEEE Trans Microw Theory Tech 69(2):11
2. Boano CA, Tsiftes N, Voigt T, Brown J, Roedig U (2010) The impact of temperature on outdoor industrial sensor net applications. IEEE Trans Ind Inf 6(3):451–459
3. Breen TJ, Walsh EJ, Punch J, Shah AJ, Bash CE (2011) From chip to cooling tower data centre modelling: influence of server inlet temperature and temperature rise across cabinets. ASME J Electron Pack 133:011004-1-011004–8
4. Broughton J, Smet V, Rao T, Joshi Y (2018) Review of thermal packaging technologies for automotive power electronics for traction purposes. ASME J Electron Pack 140:010801-1–11
5. Cermak M, MajidBahrami M, Lau K (2017) Development of a passively cooled outdoor telecom power enclosure. In: 33rd IEEE SEMI-THERM symposium, pp 13–18
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