Author:
Dash S. K.,Bhanumathy Y. R.,Prakasha Rao P. J. V. K. S.
Reference15 articles.
1. C.R. Koripella, Mechanical behavior of ceramic capacitors. IEEE Trans. Compon. Hybrids Manuf. Technol. 14(4) (1991) (December)
2. G. de With, Structural integrity of ceramic multilayer capacitor materials and ceramic multilayer capacitors. J. Eur. Ceram. Soc. 12, 323–336 (1993)
3. A. Teverovsky, Effect of manual soldering induced stress in ceramic capacitors, NASA Electronic Parts and Packaging (NEPP) Program, December, 2008
4. M. Tarr, Failure mechanisms in ceramic capacitors, in Proceedings of Online Postgraduate Courses for the Electronics Industry (2007),
http://www.ami.ac.uk/courses/topics/0179_fmcc/index.html
5. D.S. Erdahl, I.C. Ume, Online-offline laser ultrasonic quality inspection tool for multilayer ceramic capacitors. IEEE Trans. Adv. Packag. 27, 647–653 (2004)
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