1. Ye, F.: Influence of via stub on signal integrity and its solution. Aviat. Comput. Technol. 48(05), 257–260 (2018). (in Chinese)
2. Hu, J.D.: Research on the influence of hole on signal integrity in high speed circuit design. Nucl. Electron. Detect. Technol. 036(006), 596–601 (2016). (in Chinese)
3. Tian, Y.: Influence of high-speed backplane stub on signal quality and its improvement. Changjiang Inf. Communi. 34(01), 138–141 (2021). (in Chinese)
4. Li, Y.S., Liu, Y.: Signal Integrity and Power Integrity Analysis. Electronic Industry Press, Beijing (2019). (in Chinese)
5. Benjamin, D.: Signal integrity characterization of via stubs on high-speed DDR4 channels. In: DesignCon 2020, Santa Clara, California (2020)