Techniques for Sorting Components from Dismembered Medical PCBs-Reference-Cited by-同舟云学术

Techniques for Sorting Components from Dismembered Medical PCBs

Published:2019 Issue: Volume: Page:59-64
ISSN:1680-0737
Container-title:6th International Conference on Advancements of Medicine and Health Care through Technology; 17–20 October 2018, Cluj-Napoca, Romania
language:
Short-container-title:

Author:

Holonec R.,Grindei L.,Purcar M.,Copîndean R.,Dragan F.

Publisher

Springer Singapore

Link

http://link.springer.com/content/pdf/10.1007/978-981-13-6207-1_10

Reference14 articles.

1. Akkucuk, U.: Handbook of Research on Waste Management Techniques for Sustainability, 1 edn. IGI Global (2015)

2. Shantaram, M., Shafy, S., Fatimah, R.: A concern of e-waste in the hospital setting and its ways of disposal. Int. J. Appl. Biol. Pharm. Technol. 5(2) (2014)

3. Matkowski, P., Friedel, K.: Management of waste electrical and electronic equipment in Poland—ecological, organizing and economical aspects. In: 2008 International Students and Young Scientists Workshop—Photonics and Microsystems, Wroclaw, Poland, 20–22 June 2008

4. Guimarães, R., Carvalho, J., Leal, V., Guerner Dias, A.J.: Characterization, treatment proposal and metal recovery in waste of active implantable medical devices. Comunicações Geológicas 101, Especial II, 1011–1014 (2014)

5. Zeng, X., Zheng, L., Xie, H., Lu, B., Xia, K., Chao, K., Li, W., Yang, J., Lin, S., Li, J.: Current status and future perspective of waste printed circuit boards recycling. In: The Seventh International Conference on Waste Management and Technology. Procedia Environ. Sci. 16, 590–597 (2012)

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. A machine learning framework for urban mining: A case study on recovery of copper from printed circuit boards;Minerals Engineering;2022-04

2. Research and innovation project based on recovery of the components and materials from IT and telecommunication waste;2021 30th Annual Conference of the European Association for Education in Electrical and Information Engineering (EAEEIE);2021-09-01

3. Review of THz-based semiconductor assurance;Optical Engineering;2021-06-03