Prediction and Optimization of Residual Stress After Reflow Soldering of BGA Solder Joints Based on Multi-fidelity Surrogate Model-Reference-Cited by-同舟云学术

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Prediction and Optimization of Residual Stress After Reflow Soldering of BGA Solder Joints Based on Multi-fidelity Surrogate Model

Published:2024 Issue: Volume: Page:815-833
ISSN:2211-0984
Container-title:Mechanisms and Machine Science
language:en
Short-container-title:

Author:

Zhang Chulei,Wang Ru,Hu Zixiang,Wu Wenzhi,Yu Jingdan,Yan Yan

Publisher

Springer Nature Singapore

Link

https://link.springer.com/content/pdf/10.1007/978-981-97-0922-9_52

Reference27 articles.

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2. Xuhui, X.: Advantages and applications of microelectronic packaging technology. Wireless Interconnection Technol. 18(04), 102–103 (2021)

3. Dan, Z.: Research on the development of microelectronics manufacturing and packaging technology. Sci. Technol. Innovation Herald 16(27), 70–71 (2019)

4. Zhiwei, L.: Discussion on microelectronic packaging technology. Comput. Prod. Circ. (02), 150 (2020)

5. Shengjun, Z.: Residual stress analysis and optimization after reflow welding of BGA lead-free solder joints. J. Mech. Eng. 56(10), 86–94 (2020)

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