Numerical Simulation of Wire Electrode Temperature Profiles in Three Dimensions During the Electric Dump Process
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Publisher
Springer Nature Singapore
Link
https://link.springer.com/content/pdf/10.1007/978-981-19-2188-9_104
Reference14 articles.
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4. Yang X, Feng G, Teng Q (2012) Temperature field simulation of wire electrode in high-speed and medium-speed WEDM under moving heat source. Procedia CIRP 1(1):633–638. https://doi.org/10.1016/j.procir.2012.04.112
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