Author:
Zhu Xiaoming,Chen Jie,Wang Hui,Li Xuefei,Li Jinpeng,Qiu Ruichang,Liu Zhigang
Publisher
Springer Nature Singapore
Reference10 articles.
1. Wang, H., Liserre, M., et al.: Toward reliable power electronics: challenges, design tools, and opportunities. Indust. Electron. Magaz. IEEE 7(2), 17–26 (2013)
2. Choi, U.M., Jrgensen, S., Blaabjerg, F.: Advanced accelerated power cycling test for reliability investigation of power device modules. IEEE Trans. Power Electron. 31(12), 8371–8386 (2016)
3. Yang, S., Bryant, A., Mawby, P., et al.: An industry-based survey of reliability in power electronic converters. IEEE Trans. Ind. Appl. 47(3), 1441–1451 (2011)
4. Wei, K., Du, M., Xie, L., et al.: Study of bonding wire failure effects on external measurable signals of IGBT module. IEEE Trans. Device Mater. Reliab. 14(1), 83–89 (2014)
5. Zhang, J., Zhang, L., Cheng, Y.: Review of the lifetime evaluation for the IGBT module. Trans. China Electrotechn. Soc. 36(12), 2560–2575 (2021)