An Approach to Handle General-Shape Floating Metals
Author:
Publisher
Springer Nature Singapore
Link
https://link.springer.com/content/pdf/10.1007/978-981-19-3250-2_8
Reference11 articles.
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4. Fischer K et al (2015) Low-k interconnect stack with multi-layer air gap and tri-metal-insulator-metal capacitors for 14nm high volume manufacturing. In: Proceedings of IEEE IITC/MAM. Grenoble, pp 5–8
5. Le Coz Y, Iverson RB (1992) A stochastic algorithm for high speed capacitance extraction in integrated circuits. Solid-State Electron 35(7):1005–1012
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