Publisher
Springer Nature Singapore
Reference21 articles.
1. Qian Z, Zhang J, Sheng K (2014) Status and development of power semiconductor devices and its applications. Proceedings of the Chinese Society of Electrical Engineering 34(29):5149–5161 (in Chinese)
2. Khazaka R, Mendizabal L, Henry D et al (2015) Survey of high-temperature reliability of power electronics packaging components. IEEE Trans Power Electron 30(5):2456–2464
3. Sato M, Kumada A, Hidaka K et al (2014) On the nature of surface discharges in silicone-gel: prebreakdown discharges in cavities. In: 2014 IEEE conference on electrical insulation and dielectric phenomena (CEIDP). Des Monies, IA, USA: IEEE, pp 19–22
4. Yao Y, Lu G, Boroyevich D et al (2015) Survey of high-temperature polymeric encapsulants for power electronics packaging. IEEE Transactions on Components, Packaging and Manufacturing Technology 5(2):168–181
5. Salvatierra LM et al (2016) Self-healing during electrical treeing: a feature of the two-phase liquid-solid nature of silicone gels. IEEE Trans Dielectr Electr Insul 23(2):757–767