Introduction to Molecular Dynamics Simulations
Author:
Publisher
Springer Nature Singapore
Link
https://link.springer.com/content/pdf/10.1007/978-981-19-3092-8_1
Reference72 articles.
1. Lee, J.G.: Computational Materials Science: An Introduction. CRC Press (2016)
2. Rajasekaran, G., Narayanan, P., Parashar, A.: Effect of point and line defects on mechanical and thermal properties of graphene: a review. Crit. Rev. Solid State Mater. Sci. 41, 47–71 (2016)
3. Tadmor, E.B., Miller, R.E.: Modeling Materials: Continuum, Atomistic and Multiscale Techniques. Cambridge University Press (2011)
4. Buehler, M.J.: Atomistic Modeling of Materials Failure. Springer, US (2008)
5. Wagner, N.J., Holian, B.L., Voter, A.F.: Molecular-dynamics simulations of two-dimensional materials at high strain rates. Phys. Rev. A 45, 15 (1992)
Cited by 23 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Comparative analysis of molecular dynamics and method of moments in two-dimensional concentric circular layers;Journal of Physics: Condensed Matter;2024-07-04
2. Synergistic effects of temperature and strain rate on tensile properties of simulated Ni-6Cu alloy with Σ3 non-Arrhenius grain boundary;Molecular Simulation;2024-03-20
3. Unravelling the atomistic-scale insights into tensile response of equiatomic cupronickel alloy with pre-existing faceted grain boundary interface;Results in Surfaces and Interfaces;2024-02
4. Role of Biochar as a Sustainable Sorbent for Fipronil Removal from Aqueous and Soil Environments;Microbiology-2.0 Update for a Sustainable Future;2024
5. Active and Passive Solar Distillation—A Detailed Review;Materials Horizons: From Nature to Nanomaterials;2024
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3