Application Prospect of Uniform Metal Droplet-Based 3D Printing
Author:
Publisher
Springer Nature Singapore
Link
https://link.springer.com/content/pdf/10.1007/978-981-99-0965-0_9
Reference9 articles.
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3. Xiong W, Qi L, Luo J, et al. Experimental investigation on the height deviation of bumps printed by solder jet technology. J Mater Process Technol. 2017;243:291–8.
4. Takagi K, Masuda S, Suzuki H, et al. Preparation of monosized copper micro particles by pulsated orifice ejection method. Mater Trans. 2006;47(5):1380–5.
5. Zhong SY, Qi LH, Luo J, et al. Effect of process parameters on copper droplet ejecting by pneumatic drop-on-demand technology. J Mater Process Technol. 2014;214(12):3089–97.
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