Author:
Liaw Kim Leong,Rosle Amir Farid Haziq bin,Hendarti Religiana,Kurnia Jundika Candra
Publisher
Springer Nature Singapore
Reference25 articles.
1. Alimohammadi M, Aghli Y, Alavi ES, Sardarabadi M, Passandideh-Fard M (2017) Experimental investigation of the effects of using nano/phase change materials (NPCM) as coolant of electronic chipsets, under free and forced convection. Appl Therm Eng 111:271–279. https://doi.org/10.1016/j.applthermaleng.2016.09.028
2. Liu HR, Li BJ, Hua LJ, Wang RZ (2022) Designing thermoelectric self-cooling system for electronic devices: experimental investigation and model validation. Energy 243:123059. https://doi.org/10.1016/j.energy.2021.123059
3. He Z, Yan Y, Zhang Z (2021) Thermal management and temperature uniformity enhancement of electronic devices by micro heat sinks: a review. Energy 216:119223. https://doi.org/10.1016/j.energy.2020.119223
4. Cengel AY, Ghajar A (2019) Heat and mass transfer: fundamentals and applications, 6th edn. McGraw-Hill Education. [Online]. https://www.mheducation.com/highered/product/heat-mass-transfer-fundamentals-applications-cengel-ghajar/M9780073398198.html. Accessed 30 May 2022
5. Mohammadi M, Taheri A, Passandideh-Fard M, Sardarabadi M (2020) Electronic chipset thermal management using a nanofluid-based mini-channel heat sink: an experimental study. Int Commun Heat Mass Transf 118:104836. https://doi.org/10.1016/j.icheatmasstransfer.2020.104836