Author:
Kandlikar Satish G.,Ganguly Amlan
Reference58 articles.
1. S.G. Kandlikar, Review and projections of integrated cooling systems for 3D ICs. J. Electr. Packag. 136(2), 024001, 11. http://doi.org/10:1115/1.4027175
2. D.B. Tuckerman, R.F. Pease, High performance heat sinking for VLSI. IEEE Electron Dev. Lett. 2(5), 126–129 (1981)
3. S.G. Kandlikar, A.V. Bapat, Evaluation of Jet impingement, spray, and microchannel chip cooling options for high heat flux removal. Heat Transfer Eng. 28(11), 911–923 (2007)
4. A.C. Cotler, E.R. Brown, V. Dhir, M.C. Shaw, Chip-Level spray cooling of an LD-MOSFET RF Power amplifier. IEEE Trans. Comp. Packag. Technol. 27(2), 411–416 (2004)
5. C.J. Chang, H.T. Chen, C. Gau, Flow and heat transfer of a microjet impinging on a heated chip: Part I—micro free and impinging jet. Nanoscale Microscale Thermophys. Eng. 17(1), 50–68 (2013)
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