1. https://advisory.kpmg.us/articles/2020/impact-of-covid-19-on-semiconductor-industry.html.
2. https://www.statista.com/statistics/867210/worldwide-semiconductor-foundries-by-revenue/.
3. https://www.counterpointresearch.com/foundry-industry-revenue-growth-continue-2021/.
4. https://www.globenewswire.com/news-release/2021/02/02/2167973/0/en/OSAT-Market-was-valued-at-USD-31-64-billion-in-2020-and-is-expected-to-reach-USD-49-71-billion-at-a-CAGR-of-7-3-over-the-forecast-period-2021-2026.html.
5. Qin, I., O. Yauw, G. Schulze, A. Shah, B. Chylak, and N. Wong, “Advances in Wire Bonding Technology for 3D Die Stacking and Fan Out Wafer Level Package”, IEEE/ECTC Proceedings, May 2017, pp. 1309–1315.