1. Yu, Q., Shibutani, T., Kobayashi, Y., Shiratori, M.: The effect of voids on thermal reliability of BGA lead free solder joint and reliability detecting standard. In: Proceedings of 10th Intersociety Conference on Phenomena in Electronics Systems, Thermal and Thermomechanical, San Diego, California, 30 May–2 June 2006, pp. 1024–1030 (2006)
2. Truong, M.T., Kim, S.: Automatic image thresholding using Otsu’s method and entropy weighting scheme for surface defect detection. Softw. Comput. 22, 4197–4203 (2018)
3. Mei, S., Wang, Y., Wen, G.: Automatic fabric defect detection with a multi-scale convolutional denoising autoencoder network model. Sens. Signal Process. Vis. Comput. 18, 1064 (2018)
4. Wang, T., Chen, Y., Qiao, M., Snoussi, H.: A fast and robust convolutional neural network-based defect detection model in product quality control. Int. J. Adv. Manuf. Technol. 94, 3465–3471 (2018)
5. Said, A.F., Bennett, B.L., Karam, L.J., Pettinato, J.S., Siah, A., Goodman, K.: Automated void detection in solder balls in the presence of vias and other artifacts. IEEE Trans. Compon. Packag. Manuf. Technol. 2(11), 1890–1901 (2012)