1. Wang W, Nelson PC, Tirpak TM (1999) Optimization of high-speed multistation SMT placement machine using evolutionary algorithms. IEEE Trans Electron Packag Manuf 22(2)
2. Crama Y, Kolen AWJ, Oerlemans AG, Spieksma FCR (1990) Throughput rate optimization in the automated assembly of PCB. Ann Oper Res 26(1):455–480
3. Egbelu PJ, Wu CT, Pilgaonkar R (1999) Robotic assembly of PCB with component feeder location consideration. Prod Plann Control 7(2):195–197
4. Cappo FF, Miliken JC (1999) MLC Surface Mount Technology. Surf Mount 2:99–104
5. Sarkhel A, Ma B-T, Bernier WE (1995) Solder bumping process for surface mount assembly of ultra fine pitch components. New Crit Technol SMT 2:17–22