Author:
Ashok Kumar B.,Senthilrani S.,Keerthana H.
Reference16 articles.
1. Srinivasan J, Adve SV, Bose P, Rivers JA (2004) The case for lifetime reliability-aware microprocessors. In: ACM SIGARCH computer architecture news, IEEE Computer Society, vol 132, p 276
2. Srinivasan J, Adve SV, Bose P, Rivers JA (2004) The impact of technology scaling on lifetime reliability. In: International conference on dependable systems and networks, IEEE, pp 177–186
3. Gelsinger PP (2001) Microprocessors for the new millennium: challenges, opportunities, and new frontiers. In: Proceedings on ISSCC, pp 22–25
4. Chiang TY, Banerjee K, Saraswat KC (2002) Analytical thermal model for multilevel VLSI interconnects incorporating via effect. IEEE Electron Device Lett 23(1):31–33
5. Zhang Y, Parikh D, Sankaranarayanan K, Skadron K, Stan M (2003) HotLeakage: a temperature-aware model of subthreshold and gate leakage for architects. Univ Virginia, Tech Rep May 2003, CS-2003–05