Thermal, Microstructure, and Hardness Properties of Molybdenum Nanoparticles Added Tin -Bismuth Solder Alloy for Low-Temperature Soldering Application
Author:
Publisher
Springer Nature Singapore
Link
https://link.springer.com/content/pdf/10.1007/978-981-19-3053-9_3
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4. Kar A et al (2008) Evolution of mechanical and electrical properties of tin–lead and lead free solder to copper joint interface. Mater Lett 62(1):151–154
5. Billah M, Shorowordi KM, Sharif A (2014) Effect of micron size Ni particle addition in Sn–8Zn–3Bi lead-free solder on the microstructure, thermal and mechanical properties. J Alloy Compd 585C:32–39
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