Bulk copper electrodeposition on gold imaged by in situ STM: morphology and influence of tip potential-Reference-Cited by-同舟云学术

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Bulk copper electrodeposition on gold imaged by in situ STM: morphology and influence of tip potential

Published:1996-02 Issue:2 Volume:26 Page:161-170
ISSN:0021-891X
Container-title:Journal of Applied Electrochemistry
language:en
Short-container-title:JOURNAL OF APPLIED ELECTROCHEMISTRY

Author:

Andersen J. E. T.,Bech-Nielsen G.,M�ller P.,Reeve J. C.

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrochemistry,General Chemical Engineering

Link

http://link.springer.com/content/pdf/10.1007/BF00364066.pdf

Reference28 articles.

1. A. A. Gewirth and K. J. Hanson, Interface, Spring (1993) 37.

2. J. Wiechers, T. Twomey, D. M. Kolb and R. J. Behm, J. Electroanal. Chem. 248 (1988) 451.

3. O. M. Magnussen, J. Hotlos, R. J. Nichols and R. J. Behm, Phys. Rev. Lett. 64 (1990) 2929.

4. R. J. Nichols, D. M. Kolb and R. J. Behm, J. Electroanal. Chem. 313 (1991) 109.

5. U. Stimming, R. Vogel, D. M. Kolb and T. Will, J. Power Sources 43-44 (1993) 169.

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