Deposition of nanocomposite Cu–TiO2 using heterogeneous colliding plasmas-Reference-Cited by-同舟云学术

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Deposition of nanocomposite Cu–TiO2 using heterogeneous colliding plasmas

Published:2018-02-21 Issue:3 Volume:124 Page:
ISSN:0946-2171
Container-title:Applied Physics B
language:en
Short-container-title:Appl. Phys. B

Author:

Pandey Pramod K.^ORCID,Thareja Raj K.,Singh Ravi Pratap,Costello John T.

Funder

Science Foundation Ireland

FP7 International Cooperation

FP7 People: Marie-Curie Actions

FP7 EU COST Action

National Science Foundation

Publisher

Springer Science and Business Media LLC

Subject

General Physics and Astronomy,Physics and Astronomy (miscellaneous),General Engineering

Link

http://link.springer.com/article/10.1007/s00340-018-6919-8/fulltext.html

Reference36 articles.

1. T. Szorenyi, Z. Geretovszky, Thin solid films. 453–454, 431 (2004)

2. P.K. Pandey, R.K. Thareja, Phys. Plasmas. 18, 033505 (2011)

3. I. Umezu, S. Yamamoto, A. Sugimura, Appl. Phys. A. 101, 133 (2010)

4. C. Koral, A. De Giacomo, X. Mao, V. Zorba, R.E. Russo, Spectrochim. Acta B. 125, 11 (2016)

5. H. Luna, K.D. Kavanagh, J.T. Costello, J. Appl. Phys. 101, 033302 (2007)

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