Hypoplastic modeling of inherent anisotropy in normally and overconsolidated clays
Author:
Publisher
Springer Science and Business Media LLC
Subject
Earth and Planetary Sciences (miscellaneous),Geotechnical Engineering and Engineering Geology
Link
https://link.springer.com/content/pdf/10.1007/s11440-023-01923-3.pdf
Reference66 articles.
1. Adachi T, Oka F, Hirata T, Hashimoto T, Nagaya J, Mimura M, Pradhan TB (1995) Stress-strain behavior and yielding characteristics of Eastern Osaka clay. Soils Found 35(3):1–13
2. Al-Karni AA, Al-Shamrani MA (2000) Study of the effect of soil anisotropy on slope stability using method of slices. Comput Geotech 26(2):83–103
3. Azami A, Pietruszczak S, Guo P (2010) Bearing capacity of shallow foundations in transversely isotropic granular media. Int J Numer Anal Methods Geomech 34(8):771–793
4. Bauer E, Huang W, Wu W (2004) Investigations of shear banding in an anisotropic hypoplastic material. Int J Solids Struct 41(21):5903–5919
5. Casagrande A, Carillo N (1944) Shear failure of anisotropic materials. Soil Mech Found Eng 53(6):47–58
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