Evaluation of Heat Transfer Augmentation in a Nanofluid-Cooled Microchannel Heat Sink-Reference-Cited by-同舟云学术

Evaluation of Heat Transfer Augmentation in a Nanofluid-Cooled Microchannel Heat Sink

Published:2006-08-24 Issue:3-4 Volume:25 Page:187-196
ISSN:0164-0313
Container-title:Journal of Fusion Energy
language:en
Short-container-title:J Fusion Energ

Author:

Abbassi Hessamoddin,Aghanajafi Cyrus

Publisher

Springer Science and Business Media LLC

Subject

Nuclear Energy and Engineering,Nuclear and High Energy Physics

Link

http://link.springer.com/content/pdf/10.1007/s10894-006-9021-x.pdf

Reference36 articles.

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4. T. Kishimoto and T. Ohsaki, in 25th Electrics Components Conference Proceedings, 595–601 (1986)

5. R. J. Philips, in A. Bar-Cohen and A. D. Kraus (eds), Advances in Thermal Modelling of Electronic Components and Systems, vol 2. ASME, New York, (Chapter 3) (1990)

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