Author:
Baker Z. Q.,Abdelazeez M. K.,Zihlif A. M.
Publisher
Springer Science and Business Media LLC
Subject
Mechanical Engineering,Mechanics of Materials,General Materials Science
Reference11 articles.
1. D. M. Bigg, J. Reology 25 (1984) 501.
2. S. Radhakrishnan, J. Mater. Sci. Lett. 4 (1985) 1445.
3. Ping Sheng, Phys. Rev. B. 21 (1980) 2180.
4. D. M. Bigg, W. Mirick and D. E. Stutz, Poly. Testing 5 (1985) 169.
5. D. M. Bigg, ?The Effect of Compounding on the Condutive Properties of EMI Shielding Compounds?, Proceedings of the 15th Akron Polymer Conference on Advances in Polymer Processing, University of Akron, 24?25 May, 1984.
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