Author:
Seo Jongchul,Jang Wonbong,Han Haksoo
Publisher
Springer Science and Business Media LLC
Subject
Materials Chemistry,Polymers and Plastics,Organic Chemistry,General Chemical Engineering
Reference26 articles.
1. L. F. Thompson, C. G. Willson, and S. Tagawa, inPolymers for Microelectronics: Resists and Dielectrics, ACS Symposium, Washington, D.C., 1994, No. 537.
2. J. J. Licari and L. A. Hughes, inHandbook of Polymer Coatings for Electronics; Chemistry, Technology and Applications, 2nd Ed., Noyes Publications, New Jersey, 1990.
3. E. D. Feit, inPolymer Materials for Electronic Applications, ACS Symposium, Washington D. C., 1982, No. 184.
4. L. T. Manzione, inPlastic Packaging of Microelectronic Devices, Van Nostrand Reinhold, New York, 1990.
5. C. L. Soles and A. F. Yee,J. Polym. Sci., Polym. Phys.,38, 792 (2000).
Cited by
33 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献