Electrochemical Nucleation and Growth of Copper–Tin Alloys from Ammonia-Free Citrate-Based Electrolyte
Author:
Publisher
Springer Science and Business Media LLC
Subject
Multidisciplinary
Link
https://link.springer.com/content/pdf/10.1007/s13369-022-07592-w.pdf
Reference37 articles.
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2. da Silva, P.S.; de Senna, L.F.; Lago, D.C.B.: Do: Cu-Sn coatings produced using environmentally non-aggressive electrolyte containing sodium tartrate. Mater. Res. 20, 667–675 (2017). https://doi.org/10.1590/1980-5373-mr-2016-0962
3. Evans, J.W.: A guide to lead-free solders: physical metallurgy and reliability. Springer Science & Business Media (2007)
4. Nassef, A.; El-Hadek, M.: Microstructure and mechanical behavior of hot pressed Cu-Sn powder alloys. Adv. Mater. Sci. Eng. 2016, 1–10 (2016). https://doi.org/10.1155/2016/9796169
5. Báez-Pimiento, S.; Rosas-Carballar, O.; Hernández-Rojas, M.E.: Manufacturing of Cu-Sn foams through SDP. Rio Jan Matér (2018). https://doi.org/10.1590/s1517-707620180002.0340
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