1. Aden, J. S. and Kahn, J. A., 1989, “Thin Film Device for an Ink Jet Printhead and Process for the Manufacturing,”United States Patent, Patent No. 4, 809, 428.
2. Chang, L. S., 1989, “Mechanisms of Failure of Thermal Ink-Jet Thin Film Devices under Stressed Conditions,“ Proceedings of the SID, Vol. 30/ 1, pp. 57–63.
3. Chang, L. S., Gendler, P. L. and Jou, J. H., 1991, “Thermal, Mechanical and Chemical Effects in the Degradation of the Plasma-Deposited tf-SiC: H passivation Layer in a Multilayer Thin- Film Device,”Journal of Materials, Science 26, pp. 1882–1890.
4. Kamisuki. S.. Fujii, M., Takekoshi, T., Tezuka. and Atobe. M., 2000, “A High Resolu tion, Electrostatically-Driven Commercial Inkjet Head,”Proc. of IEEE, The 13 th Annual International Workshop on Micro Electro Mechanical Systems, Miyazaki, Japan. January, pp. 793–798.
5. Kolpekwar, A. and Blanton, R. D., 1997. “Development of a MEMS Testing Methodology,”Proc. International Test Conference IEEE, pp. 923–931.