Publisher
Springer Science and Business Media LLC
Subject
Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Reference158 articles.
1. C. M. Osburn and A. Reisman, J. Electron. Mater.16, 223 (1987).
2. Y. Kim, H. Z. Massoud, and R. B. Fair, J. Electron. Mater.18, 143 (1989).
3. K. K. Ng and W. T. Lynch, IEEE Trans. Electron Dev.Ed-34, 503 (1987).
4. D. Sharma, S. Goodwin-Johansson, D. S. Wen, C. K. Kim, and C. M. Osburn, Proc. of First Int. Symp. on Ultra Large Scale Integration Sci. and Tech., The Electrochem. Soc.,87-11, 49 (1987).
5. S. Goodwin-Johansson and M. Kellam, private communications.
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