Facile dynamic current deposition of high tensile gradient Cu foil with (110) preferred orientation-Reference-Cited by-同舟云学术

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Facile dynamic current deposition of high tensile gradient Cu foil with (110) preferred orientation

Published:2022-09-16 Issue:2 Volume:66 Page:597-602
ISSN:2095-8226
Container-title:Science China Materials
language:en
Short-container-title:Sci. China Mater.

Author:

Liu Wei,Li Geng,Wang Yuankun,Hao Zhimeng,Zhang Yufeng,Yan Zhenhua,Zhao Qing,Chen Jun

Publisher

Springer Science and Business Media LLC

Subject

General Materials Science

Link

https://link.springer.com/content/pdf/10.1007/s40843-022-2169-1.pdf

Reference28 articles.

1. Peng J, Chen B, Wang Z, et al. Surface coordination layer passivates oxidation of copper. Nature, 2020, 586: 390–394

2. Chen AL, Shang N, Ouyang Y, et al. Electroactive polymeric nanofibrous composite to drive in situ construction of lithiophilic SEI for stable lithium metal anodes. eScience, 2022, 2: 192–200

3. Nothdurft P, Riess G, Kern W. Copper/epoxy joints in printed circuit boards: Manufacturing and interfacial failure mechanisms. Materials, 2019, 12: 550

4. Zhao H, Chen W, Wu M, et al. Influence of low oxygen content on the recrystallization behavior of rolled copper foil. Oxid Met, 2018, 90: 203–215

5. Kang X, Fu G, Wang X, et al. Copper-cobalt-nickel oxide nanowire arrays on copper foams as self-standing anode materials for lithium ion batteries. Chin Chem Lett, 2021, 32: 938–942

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1. Bromine-enhanced polarization for strengthening ultra-thin copper foil in lithium-ion battery;Journal of Materials Research and Technology;2024-05

2. Copper electrodeposited in ice ionic electrolytes;Materials & Design;2024-03

3. Suppression of Kirkendall Voids at the Interface of Sn/nc-Cu Solder Joint;2023 24th International Conference on Electronic Packaging Technology (ICEPT);2023-08-08

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