Enhanced thermoelectric properties and electrical stability for Cu1.8S-based alloys: Entropy engineering and Cu vacancy engineering-Reference-Cited by-同舟云学术

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Enhanced thermoelectric properties and electrical stability for Cu1.8S-based alloys: Entropy engineering and Cu vacancy engineering

Published:2023-01-09 Issue:5 Volume:66 Page:2051-2060
ISSN:2095-8226
Container-title:Science China Materials
language:en
Short-container-title:Sci. China Mater.

Author:

Zhou Wei,Li Hezhang,Shan Zhihang,Zhang Rui,Lu Shikuo,Pei Jun,Ge Zhenhua,Zhou Min,Wang Yuanbing,Zhang Boping

Publisher

Springer Science and Business Media LLC

Subject

General Materials Science

Link

https://link.springer.com/content/pdf/10.1007/s40843-022-2306-4.pdf

Reference45 articles.

1. Snyder GJ, Toberer ES. Complex thermoelectric materials. Nat Mater, 2008, 7: 105–114

2. Zhao LD, Lo SH, Zhang Y, et al. Ultralow thermal conductivity and high thermoelectric figure of merit in SnSe crystals. Nature, 2014, 508: 373–377

3. Hu H, Zhuang HL, Jiang Y, et al. Thermoelectric Cu12Sb4S13-based synthetic minerals with a sublimation-derived porous network. Adv Mater, 2021, 33: 2103633

4. Sun FH, Dong J, Tang H, et al. Enhanced performance of thermoelectric nanocomposites based on Cu12Sb4S13 tetrahedrite. Nano Energy, 2019, 57: 835–841

5. Liang H, Guo J, Zhou YX, et al. CuPbBi5S9 thermoelectric material with an intrinsic low thermal conductivity: Synthesis and properties. J Materiomics, 2022, 8: 174–183

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Enhanced tribocatalytic degradation performance of organic pollutants by Cu1.8S/CuCo2S4 p-n junction;Journal of Colloid and Interface Science;2024-02

2. High-entropy materials for thermoelectric applications: towards performance and reliability;Materials Horizons;2024

3. Stepwise Alloying in Liquid-like Solid Solutions to Achieve Crystallographic Distortion for Regulating Thermoelectric Transport Behavior;ACS Applied Materials & Interfaces;2023-11-16

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