Buildup of Sn@CNT nanorods by in-situ thermal plasma and the electronic transport behaviors-Reference-Cited by-同舟云学术

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Buildup of Sn@CNT nanorods by in-situ thermal plasma and the electronic transport behaviors

Published:2018-05-07 Issue:12 Volume:61 Page:1605-1613
ISSN:2095-8226
Container-title:Science China Materials
language:en
Short-container-title:Sci. China Mater.

Author:

Wang Dongxing,Li Da,Muhammad Javid.,Zhou Yuanliang,Zhang Xuefeng,Wang Ziming,Lu Shanshan,Dong Xinglong,Zhang Zhidong

Publisher

Springer Science and Business Media LLC

Subject

General Materials Science

Link

http://link.springer.com/article/10.1007/s40843-018-9275-3/fulltext.html

Reference46 articles.

1. Yang H, Su Y, Ding L, et al. Rational synthesis of SnS2@C hollow microspheres with superior stability for lithium-ion batteries. Sci China Mater, 2017, 60: 955–962

2. Zhang L, Ding Y, Li R, et al. Ni-Based metal–organic framework derived Ni@C nanosheets on a Ni foam substrate as a supersensitive non-enzymatic glucose sensor. J Mater Chem B, 2017, 5: 5549–5555

3. Shah A, Ding A, Wang Y, et al. Enhanced microwave absorption by arrayed carbon fibers and gradient dispersion of Fe nanoparticles in epoxy resin composites. Carbon, 2016, 96: 987–997

4. Tans SJ, Devoret MH, Dai H, et al. Individual single-wall carbon nanotubes as quantum wires. Nature, 1997, 386: 474–477

5. Krstić V, Roth S, Burghard M. Phase breaking in three-terminal contacted single-walled carbon nanotube bundles. Phys Rev B, 2000, 62: R16353–R16355

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1. Preparation and Evaluation of an Efficient Si-CNT Anode Decorated with Sn for Lithium-Ion Batteries;Journal of Electronic Materials;2023-01-27

2. Structural regulation of carbon-coated Cu nanocapsules as thermally stable microwave absorbers;Journal of Materials Science;2022-06-22

3. Effects of Outer Shell Layer on the Electronic Transport Behaviors of Sn@SnO x Nanoparticles;physica status solidi (b);2020-11-30

4. Sn filament formation under arc discharge sputtering of SnO2/C electrode;Journal of Physics: Conference Series;2020-11-01

5. Electrical/thermal behaviors of bimetallic (Ag–Cu, Ag–Sn) nanoparticles for printed electronics;Nanotechnology;2020-01-14

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