Effect of Solidification Rate and Heat Treating on the Microstructure and Tensile Behavior of an Aluminum-Copper Alloy-Reference-Cited by-同舟云学术

Effect of Solidification Rate and Heat Treating on the Microstructure and Tensile Behavior of an Aluminum-Copper Alloy

Published:2008-11-07 Issue:6 Volume:39 Page:911-919
ISSN:1073-5615
Container-title:Metallurgical and Materials Transactions B
language:en
Short-container-title:Metall and Materi Trans B

Author:

Talamantes-Silva M.A.,Rodríguez A.,Talamantes-Silva J.,Valtierra S.,Colás R.

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Metals and Alloys,Mechanics of Materials,Condensed Matter Physics

Link

http://link.springer.com/content/pdf/10.1007/s11663-008-9204-0.pdf

Reference32 articles.

1. W.E. Kosak: U.S. Patent 6,648,351, 2003

2. W.E. Kosak: U.S. Patent 6,742,808, 2004

3. I.J. Polmear: Light Alloys, Metallurgy of the Light Metals, Edward Arnold, London, 1980

4. L. Bäckerud, G. Chai, and J. Tamminen: Solidification Characteristics of Aluminum Alloys, vol. 2, Foundry Alloys, AFS/Skanaluminium, Des Plains, IL, 1990

5. J. Campbell: Castings, 2nd ed., Butterworth-Heinemann, Oxford, United Kingdom, 2003

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