Effect of Melt Treatment on Microstructure Evolution and Coarsening Mechanism of A356 Al Alloy During Cooling Slope Rheoprocessing
Author:
Publisher
Springer Science and Business Media LLC
Subject
Materials Chemistry,Metals and Alloys,Mechanics of Materials,Condensed Matter Physics
Link
https://link.springer.com/content/pdf/10.1007/s11663-023-02768-7.pdf
Reference83 articles.
1. M. Paes and E.J. Zoqui: Mater. Sci. Eng. A, 2005, vol. 406, pp. 63–73.
2. O. Lashkari and R. Ghomashchi: J. Mater. Sci., 2006, vol. 41, pp. 5958–965.
3. S. Tahamtan, M.A. Golozar, F. Karimzadeh, and B. Niroumand: Mater. Charact., 2008, vol. 59, pp. 223–28.
4. D.G. Mallapur, S.A. Kori, and K.R. Udupa: J. Mater. Sci., 2011, vol. 46, pp. 1622–627.
5. S. Hegde and K.N. Prabhu: J. Mater. Sci., 2008, vol. 43, pp. 3009–027.
Cited by 7 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Three-Dimensional Micromechanical Modelling of Deformation Behaviour of Rheocast A356 Alloy;International Journal of Metalcasting;2024-05-10
2. A phenomenological constitutive model of Novel Rheo Gravity Die Cast Al-15Mg2Si-4.5Si-0.01Sr-0.015B composite;Materials Today Communications;2024-03
3. Redefine trigonometric cubic B-spline collocation scheme for solving convection-diffusion equation;International Journal of Computing Science and Mathematics;2024
4. Microstructural and Mechanical Characterization of AM60 Alloy in Semisolid Rheo-die casting with Varying Injection Velocity;International Journal of Metalcasting;2023-11-11
5. Differential scanning calorimetry of aluminium EN AB-42000 alloy rheocasting semi-solid in different stage heating rates;Innovative Infrastructure Solutions;2023-10-17
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3