Funder
National Aeronautics and Space Administration
Publisher
Springer Science and Business Media LLC
Subject
Electrical and Electronic Engineering,Applied Mathematics,Mechanical Engineering,Ocean Engineering,Aerospace Engineering,Control and Systems Engineering
Reference53 articles.
1. Beck, J.L., Jayakumar, P.: Class of masing models for plastic hysteresis in structures. In: Proceedings 14th ASCE Structures Congress, Chicago, IL (1996)
2. Bennett, K.C., Zecevic, M., Luscher, D.J., Lebensohn, R.A.: A thermo-elastoplastic self-consistent homogenization method for inter-granular plasticity with application to thermal ratcheting of tatb. Adv. Model. Simul. Eng. Sci. 7(3), 1–32 (2020)
3. Biolek, D., Biolek, Z., Biolkova, V.: Memristors and other higher-order elements in generalized through-across domain. In: Proceedings of the 2016 IEEE International Conference on Electronics, Circuits and Systems (ICECS), Monte Caro, Monaco (2016)
4. Chaboche, J.L.: Continuum damage mechanics: present state and future trends. Nucl. Eng. Des. 105, 19–33 (1987)
5. Chua, L.O.: Nonlinear circuit foundations for nanodevices, Part i: the four-element torus. In: Proceedings of the IEEE, vol 91 (2003)
Cited by
5 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献