450 °C Isothermal Section of the Ni-Sb-Zn Ternary System at the Zn-Rich Corner

Author:

Zhao Yuliang,Zhu Zhongxi,Yin Fucheng,Long Zhaohui,Wu Yu

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Metals and Alloys,Condensed Matter Physics

Reference42 articles.

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2. N.Y. Tang, Control of Silicon Reactivity in General Galvanizing, J. Phase Equilib. Diff., 2008, 29, p 337-344

3. Z.W. Chen, N.F. Kennon, J.B. See, and M.A. Barter, Technigalva and Other Developments in Batch Hot-Dip Galvanizing, JOM, 1992, 44(1), p 22-26

4. J. Zervoudis and G. Anderson, A Review of Bath Alloy Additives and their Impact on the Quality of the Galvanized Coating, 6th Asia Pacific General Galvanizing Conference, Cairns, Australia, 2005, p 1-17

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1. Intermetallic Growth at the Interfaces Between Zn4Sb3 Thermoelectric Material and Various Metallic Electrodes;Metallurgical and Materials Transactions A;2021-10-29

2. The Zn-Rich Corner of the Zn-Al-Ni-Sb Quaternary System at 450 and 600 °C;Journal of Phase Equilibria and Diffusion;2019-05-14

3. Phase equilibria of the Ni–Sb–Zn system at 600 °C;International Journal of Materials Research;2016-09-29

4. Experimental Investigation of the Zn-V-Sb System at 450 °C;Journal of Phase Equilibria and Diffusion;2015-01-31

5. The Zn-Rich Corner of the 450 °C Isothermal Section of the Zn-Fe-Ni-Sb Quaternary System;Journal of Phase Equilibria and Diffusion;2014-06-03

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