1. RG Medical Diagnostics, Material Safety Data Sheet for Galinstan, Wixom, MI, USA, 2006.
http://www.rgmd.com/msds/msds.pdf
2. M. Hodes, R. Zhang, L.S. Lam, R. Wilcoxon, and N. Lower, On the Potential of Galinstan Based Minichannel and Minigap Cooling, IEEE Trans. Compon. Packag. Manuf. Technol., 2014, 4, p 46-56
3. C.A. McKay, Amalgams for Improved Electronics Interconnection, IEEE Micro, 1993, 4, p 46-58
4. R. Schmid-Fetzer, Fundamentals of Bonding by Isothermal Solidification for High Temperature Semiconductor Applications, in Design Fundamentals of High Temperature Composites, Intermetallics and Metal–Ceramic System, Proceedings of the 125th TMS Annual Meeting, Anaheim CA, USA, 4–8 Feb 1996, ed. by R.Y. Lin, Y.A. Chang, R.G. Reddy, and C.T. Liu (The Minerals, Metals & Materials Society, Warrendale, 1996), p. 75–98
5. H.M. Chen, C.J. Guo, J.P. Huang, and H. Wang, Influence of Gallium Addition in Sn-Ag-Cu Lead-Fee Solder, J. Mater. Sci. Mater. Electron., 2015, 26, p 5459-5464