Author:
Liu X. J.,Yang X. F.,Yang S. Y.,Wang C. P.
Publisher
Springer Science and Business Media LLC
Subject
Materials Chemistry,Metals and Alloys,Condensed Matter Physics
Reference21 articles.
1. D. Suraski and K. Seelig, The Current Status of Lead-Free Solder Alloys, IEEE Trans. Electron. Packag. Manuf., 2001, 24(4), p 244-248
2. K.W. Moon, W. Boettinger, U. Kattner, F. Biancaniello, and C. Handwerker, Experimental and Thermodynamic Assessment of Sn-Ag-Cu Solder Alloys, J. Electron. Mater., 2000, 29(10), p 1122-1136
3. C.S. Oh, J.H. Shim, B.J. Lee et al., A Thermodynamic Study on the Ag-Sb-Sn System, J. Alloy Compd., 1996, 238(1), p 155-166
4. S. Chen, A. Zi, W. Gierlotka et al., Phase Equilibria of Sn–Sb–Cu System, Mater. Chem. Phys., 2012, 132(2), p 703-715
5. X.J. Liu, M. Kinaka, Y. Takaku, I. Ohnuma, R. Kainuma, and K. Ishida, Experimental Investigation and Thermodynamic Calculation of Phase Equilibria in the Sn-Au-Ni System, J. Electron. Mater., 2005, 34(5), p 670-679
Cited by
2 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献