Modeling multivariate dependencies for manufacturing single-mode I/O structures of integrated MMI-based splitters in glass sheets

Author:

Roth Jan-PhilippORCID,Kühler Thomas,Griese Elmar

Publisher

Springer Science and Business Media LLC

Subject

Electrical and Electronic Engineering,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference13 articles.

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2. Demmer, P., Modinger, R., Bauer, J., Ebling, F., Schröder, H., Beil, P., Albrecht, H., Beier, A., Pfeiffer, K., Franke, M., Griese, E., Reuber, M., Kostelnik, J.: New generation interconnection technology: printed circuit boards with integrated optical layers. In: Proceedings of the 2005 9th IEEE Workshop on Signal Propagation on Interconnects, Garmisch-Partenkirchen, Germany 2005, pp. 247–257 (2005)

3. Griese, E.: A high-performance hybrid electrical-optical interconnection technology for high-speed electronic systems. IEEE Trans. Adv. Packag. 24(3), 375–383 (2001)

4. Kühler, T., Griese, E.: Modeling the diffusion process for developing optical waveguides for PC-board integration, 1st ed., ser. In: Integration of Practice-Oriented Knowledge Technology: Trends and Prospectives. Springer, Berlin (2013)

5. Ramaswamy, R., Srivastava, R.: Ion-exchanged glass waveguides: a review. J. Lightw. Technol. 6(6), 984–1000 (1988)

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