Author:
Tran A. T. T.,Hyland M. M.,Fukumoto M.,Munroe P.
Publisher
Springer Science and Business Media LLC
Subject
Materials Chemistry,Surfaces, Coatings and Films,Condensed Matter Physics
Reference43 articles.
1. S. Chandra and P. Fauchais, Formation of Solid Splats During Thermal Spray Deposition, J. Therm. Spray Technol., 2009, 18(2), p 148-180
2. P. Fauchais, Understanding Plasma Spraying, J. Phys. D Appl. Phys., 2004, 37, p 86-108
3. P. Fauchais, M. Fukumoto, A. Vardella, and M. Vardella, Knowledge Concerning Splat Formation: An Invited Review, J. Therm. Spray Technol., 2004, 13(3), p 337-360
4. H. Li, S. Costil, H.-L. Liao, C.-J. Li, M.P. Planche, and C. Coddet, Effect of Surface Conditions on the Flattening Behavior of Plasma Sprayed Cu Splats, Surf. Coat. Technol., 2006, 200, p 5435-5446
5. C.J. Li and J.L. Li, Evaporated-Gas-Induced Splashing Model for Splat Formation During Plasma Spraying, Surf. Coat. Technol., 2003, 184(1), p 13-23
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