Substrate Melting and Re-solidification During Impact of High-Melting Point Droplet Material
Author:
Publisher
Springer Science and Business Media LLC
Subject
Materials Chemistry,Surfaces, Coatings and Films,Condensed Matter Physics
Link
http://link.springer.com/content/pdf/10.1007/s11666-015-0326-z.pdf
Reference26 articles.
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3. S. Dallaire, Influence of Temperature on the Bonding Mechanism of Plasma-Sprayed Coatings, Thin Solid Films, 1982, 95, p 237-244
4. H.D. Steffens, B. Wielage, and J. Drozak, Interface Phenomena and Bonding Mechanism of Thermally-Sprayed Metal and Ceramic Composites, Surf. Coat. Technol., 1991, 45, p 299-308
5. C.H. Amon, K.S. Schmaltz, R. Merz, and F.B. Prinz, Numerical and Experimental Investigation of Interface Bonding Via Substrate Remelting of an Impinging Molten Metal Droplet, J. Heat Transf., 1996, 118, p 164-172
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