Effect of microalloying on the creep strength and microstructure of an eutectic Sn-Pb solder alloy-Reference-Cited by-同舟云学术

Effect of microalloying on the creep strength and microstructure of an eutectic Sn-Pb solder alloy

Published:1999-11 Issue:11 Volume:28 Page:1286-1289
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Wade Noboru,Akuzawa Tatsuo,Yamada Seiji,Sugiyama Daigo,Kim Ick-Soo,Miyahara Kazuya

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-999-0169-9.pdf

Reference3 articles.

1. E.E. de Kluizenaar, Soldering and Surface Mount Technol. 5, 56 (1990).

2. M. Ohtsuka, Material Life 8, 72 (1906).

3. N. Wade, S. Yamada, T. Akuzawa, Y. Hosaka, and K. Miyahara, Proc. 5th Symp. Microjoining and Assembly Technol. in Electron. (Yokohama, Japan: Japan Welding Soc. and High Temp. Soc. of Japan, 1999), p. 63.

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